GYC-EH-2 Hardener for Epoxy

EH-2 Hardener

Intro

GO YEN CHEMICAL INDUSTRIAL CO., LTD. (GYC GROUP) is a leading manufacturer of specialty chemicals in Asia. We devote ourselves to supplying products and solutions to our customers worldwide to satisfy and expand the market needs.

GYC-EH-2 is an epoxy hardener with a fully environmentally friendly chlorine-free process. It can be added to electronic substrates where high demands of halogen-free and lead-free is required. It is mainly used for high temperature resistant products (FR4, FR5), Composite Epoxy Material (CEM-1) and Copper Clad Laminate (CCL).

Besides that, GYC-EH-2 features excellent thermal stability in Tin furnace and meets the high Glass Transition Temperature (Tg) requirements.

GYC-EH-2 has the characteristics of high temperature resistance, excellent bonding strength, and chemical and corrosion resistance.

 

Properties

GRADE

GYC-EH-2

Appearance

Solid in flake

Color

Light-yellow

Softening Point (℃)

102±3

OH equivalent (g/eq)

106±2

Solvent

Acetone, MEK, PM, PMA

 

Operations

  • Please add appropriate solvents and stir it until the mixture is completely dissolved.
  • Filter the mixture by using 25µ and 5µ two-stage filter before using it.
  • An improved physical property is needed, add hydroxyl with appropriate dose which is 1.1-1.15 times as much as the dose of epoxy.
  • GYC technical department recommends that the dose should be adjusted in accordance with different epoxy hardeners development demands.

Features/Benefits

  • Fully environmentally friendly chlorine-free process
  • Improves bonding strength effectively
  • High temperature resistance
  • Excellent thermal stability
  • Increases epoxy glass transition temperature (Tg)
  • Reduces the rate of water absorption effectively for epoxy
  • Provides dimensional stability
  • Excellent oil resistance
  • Corrosion resistance
  • Improves the physical properties of the composite epoxy material
  • Can be used as an epoxy resin hardener
  • Features stable coefficient of thermal expansion
  • Excellent compatibility
  • Resistance to high temperature Tin furnace and high glass transition temperature (Tg)

 

Applications

  • Can be added into halogen-free electronic substrates
  • Used in lead-free epoxy
  • Can be applied to FR4, FR5, CEM-1
  • Can produce Copper Clad Laminate series

Packing

25KG/bag

 

Storage

  • 12 months/25℃ dry place
  • Store in a cool, dry, and well-ventilated place. Keep away from high temperature area and avoid direct sunlight
  • Note: 1. Please wear personal protective equipment when using it

                   2. Avoid using DMF solvent